Wafer processing
Laser stealth cutting is a non-contact cutting technology that can cut semiconductor materials accurately and efficiently. The wafer stealth cutting laser launched by Precilasers has achieved high-quality stealth cutting on a variety of wafer materials.
Wafer cutting laser
Real photos | Wavelength | Power | Introduction | Features |
 | 10W 20W | High-quality invisible cutting has been achieved on a variety of wafer materials. The infrared laser with editable pulse length and waveform, continuously adjustable pulse width and repetition rate, can achieve precise processing of wafers. |
|